Environmental Testing - Part 2-20: Tests - Test T: Test Methods for Solderability and Resistance to Soldering Heat of Devices with Leads
Also Known As:
The IEC 60068-2-20:2008 standard provides guidelines for testing the solderability and resistance to soldering heat of devices with leads. This standard applies to devices using solder alloys, including eutectic or near eutectic tin lead (Pb) alloys, as well as lead-free alloys.
The standard includes procedures such as the solder bath method and the soldering iron method to determine the solderability of component leads or terminations. These tests aim to ensure that the solder joints of the components meet the requirements set by IEC 61191-3 and IEC 61191-4 standards.
Additionally, the standard provides test methods to assess the ability of the component body to withstand the heat load experienced during soldering. This ensures that the component remains intact and functional after exposure to soldering heat.
Some notable changes in the fourth edition of this standard include the removal of the solder globule test and the addition of test conditions and requirements specific to lead-free solders.
| Edition | 5.0 |
| ICS Codes | 19.040 - Environmental testing |
| Language(s) | English + French |
| File Size | 993.3 KB |
