Environmental Testing - Part 2-20: Tests - Test Ta and Tb: Test Methods for Solderability and Resistance to Soldering Heat of Devices with Leads
Also Known As:
IEC 60068-2-20:2021 standard focuses on testing the solderability and resistance to soldering heat of devices with leads. The standard applies to devices with leads and the leads themselves, excluding surface mounting devices (SMD) which have their own specific testing procedures outlined in IEC 60068-2-58.
The standard provides test methods for determining the solderability and resistance to soldering heat of devices using solder alloys, including eutectic or near eutectic tin lead (Pb), or lead-free alloys. The two test methods described in the standard are the solder bath method and soldering iron method.
The main objective of this standard is to ensure that the solder joints of component leads or terminations meet the applicable requirements specified in IEC 61191-3 and IEC 61191-4. Additionally, the standard includes test methods to assess the resistance of the component body to the heat load it is exposed to during the soldering process.
In the updated edition of the standard (IEC 60068-2-20:2021), significant technical changes have been made, including the clarification and update of pre-conditioning (previously referred to as "aging") and its relationship to natural aging.
| Edition | 6.0 |
| ICS Codes | 19.040 - Environmental testing |
| Language(s) | English + French |
| File Size | 1.7 MB |
